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(주)연진코퍼레이션 유전율분석기, Dielectric Cure Monitor, Dielectric Analyzer
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Dielectric Cure Monitoring for the Study of Thermosets
Dielectric Cure Monitors &
Sensors, CureView Software
유전율분석기
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[Dielectric Cure Monitor]
LT-451 Precision
Dielectric Cure Monitor
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[Dielectric Cure Monitor]
LTF-631 High Speed Dielectric Cure Monitor
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Dielectric cure monitoring measures electrical properties to determine the cure state and viscosity of thermoset materials, at the same time providing insight into chemistry, reaction rate, formulation and physical parameters. Instruments, sensors and software from Lambient Technologies are designed for flexibility and ease of use—together they form an integrated system for studying
polymers and using the results for optimizing the final product.
Dielectric cure monitoring is the only method that can be used in Research and Development, Quality Assurance/Quality Control, and manufacturing, making quantitative information readily applicable and readily transferrable to every aspect of polymer processing.
Viscosity and resistivity in a curing material.
The cure curve is
characterized by four Critical
Points.
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Instruments
• LT-451 Dielectric Cure Monitors
Wide frequency range, versatile, optimized for
research applications
• LTF-631 High Speed Dielectric Cure Monitor
Cost effective, optimized for QA/QC and
studies of rapidly curing materials
Materials
• Epoxy
• Polyurethane
• Polyester
• Polystyrene
• Composites and laminates
• Bulk/Sheet molding compound
• Paints and coatings
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Software
• CureView for the LT-451/LTF-631s
For instrument control, cure monitoring and data analysis.
Applications
• Formulation, reaction rate and cure studies
• Diffusion studies
• Cure and process development/monitoring
• Materials testing
• Statistical quality control
Processing Environments
• Ovens
• Presses
• Autoclaves
• Pultruders and extruders
• Batch reaction vessels
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Sensors & Accessories
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The Ceramicomb-1” is designed for use in presses, molds or harsh environments where a rugged, reusable dielectric sensor is desired.
It may be mounted so the electrodes are flush with a platen or mold surface, insuring no interference with the flow of material during processing.
The sensor is constructed with silver-palladium electrodes embedded in an alumina substrate, protected by a stainless steel sheath with a nominal 1.0” (2.54 cm) diameter.
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A thermocouple is positioned in the ceramic just below the surface to allow measurement of process temperatures
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The Varicon sensor is designed for use in presses, molds, bulk materials or laminates where a thin, flexible dielectric sensor is necessary. Patterned on a polyimide substrate, the electrode array is designed to allow a choice of three sensitivities, which are selected by cutting off portions of the array at designated lines.
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The Mini-Varicon sensor is a thin, flexible dielectric sensor designed for cost-sensitive use with presses, molds, bulk materials or laminates.
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Patterned on a polyimide substrate, the electrode array is designed to allow a choice of high or low sensitivity, selected by either using the whole sensor or cutting off a portion of the array at a designated line.
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The 8-mm reusable dielectric sensor is designed for use in presses, molds or harsh environments where a tiny, reusable dielectric sensor is desired. It may be mounted so the electrode is flush with a platen or mold surface, insuring no interference with the flow of material during processing.
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The sensor is constructed with a stainless steel electrode embedded in a high temperature polymer sheath. The sheath has a nominal 8-mm diameter. A thermocouple is positioned in the sensor cable in the vicinity of the side exit joint to allow measurement of process temperatures.
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The LTP-350 MicroPress is a small thermal pneumatic press designed for the curing of SMC, BMC, epoxies, polyesters, polystyrenes, polyurethanes, silicones, laminates and other polymeric materials. Providing a portable, easily operated platform to reproduce the time-temperature-pressure processing profiles of most polymers, the LTP-350 MicroPress has independent temperature control of both upper and lower platens and can operate in either isothermal or ramp-and-hold modes. The heating temperature range is ambient to 350 Degrees C (660 Degrees F), and maximum applied force is 2000 pounds (909 Kg). Platen area is 3.0” x 3.0” (75 cm x 75 cm).
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