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Surface Techniques

Patterning and Surface Texturing Systems, Vacuum Deposition System, Adhesion Testing Equipment

Dual ATC-Orion UHV with Common Load-Lock

본 시스템은 8개의 A320-O 2" UHV 스퍼터 소스,  6-pocket 15cc UHV linear e-gun, 4개의 Resistive Thermal Sources, RF 바이어스와 함께 850°C 회전 기판 히터가 있는 sputter 및 evaporation  process chamber, 2차 틸팅 / 냉각 스테이지, RHEED, 컴퓨터 컨트롤, 4 인치 직경의 기판 및 챔버 대 챔버 이송 시스템을 위한 in-situ mask exchange를 가진 로드 락 카세트를 특징으로 합니다. 

 

General Information

AJA International ATC-M Series Multi-Technique Systems are versatile tools that combine various thin film deposition, ion milling and analytical operations in a single chamber (Hybrid Systems) or in multiple chambers (Multi-Chamber Systems) to allow the in-situ transfer of substrates from process to process without breaking vacuum. 

These systems can be built in HV or UHV configurations, and in either cylindrical, box or machined chambers styles.

Multi-Techniques employed include:

  • Magnetron Sputtering
  • E-Beam Evaporation 
  • Thermal Evaporation
  • Ion Milling
  • Ion Beam Deposition
  • Pulsed Laser Deposition
  • Ellipsometry
  • Rapid Thermal Anneal
  • Oxygenation and Nitridization
  • XPS/AUGER/LEED Analysis
  • MBE, RHEED, MOS, SIMS, RIBE

 

Dual ATC-ORION UHV with Common Load-Lock 
System features both sputter and evaporation  process chambers with (8) A320-O 2 " UHV sputter sources, (1) 6-pocket 15cc UHV linear e-gun, (4) Resistive Thermal Sources, 850°C rotating substrate heaters with RF bias, secondary tilting/cooled stage, RHEED, computer control, load-lock cassette with in-situ mask exchange for 4" diameter substrates and chamber to chamber transfer system.


 

AJA International Inc, USA
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TYPICAL MULTI-TECHNIQUE SYSTEM CONFIGURATIONS ATC UHV Dual Chambers In-situ tilt를 가진 4개의 A320-XP 2 인치 UHV 스퍼터 소스, 2개의 4- 포켓 15cc UHV linear e-gun, RF 이온 소스, 1200 l/s 터보
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