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열전도도측정기

본 열전도도측정기는 ISO 22007-2 2008에 따른 다양한 재료의 열전달 특성을 측정하는 데 사용되는 최신의 Transient Plane Heat Source method로써, 열전도도를 빠르고 정확하게 측정하는 기기입니다.

 


  • Transient Plane Heat Source method
  • Standard method: ISO 22007-2 2008
  • 열전도도측정범위: 0.005 ~ 300 W/mK
  • 측정온도: 상온 ~ 200도 (핫플레이트 또는 오븐 사용)

 

측정 재료 

금속, 세라믹, 합금, 고분자, 미네랄, 복합소재, 종이, 직물, foam(표면이 부드러운 단열재 재료 및 플레이트), 미네랄 울, 시멘트 성형물, 강화유리 복합체 플레이트 CRC, cement polystyrene board, 샌드위치 콘크리트, glass - steel panels composite plates, paper honeycomb panels, 겔, 액체, 분말, granular 및 pasty solid.

 

작동원리 

Transient Plane Source Technology(TPS)는 Hot wire method를 기반으로 개발된 열전도도를 측정하는 새로운 방법입니다. (Silas Gustafsson Sweden Chalmer University of Technology ). Principle which measures thermal properties is based on the transient temperature heating step infinite medium disc-shaped heat generated response.

Thermal resistance material formed utilizing a flat probe, both as a heat source and a temperature sensor. Relationship between thermal resistivity-temperature alloys and resistance linear relationship, that is by understanding the change in resistance can know heat loss, reflecting the thermal conductivity of the sample. i.e., the probe of this method is the use of a continuous double helix structure of the conductive foil after etching alloy formation, the outer layer of the double insulating protective layer thickness is thin, so that the probe has a certain mechanical strength and maintain the sample between The electrical insulation.

During testing, the probe is placed in the middle of the sample tested. When the current through the probe, a certain increase in temperature, the heat generated simultaneously to both sides of the sample probe diffusion, thermal diffusion rate depends on the heat transfer characteristics of the material. By recording the temperature response time of the probe, the mathematical model can be obtained directly from the thermal conductivity.

 

특징

  1. Standard: ISO 22007-2 2008.
  2. Direct measurement, testing time is about 5-160s, and can be set up, to quickly and accurately measure the coefficient of thermal conductivity, saving a lot of time.
  3. Do not suffer the effects of thermal contact resistance.
  4. No need special sample preparation, sample shapes without special requirements, bulk solids, only need the relatively smooth surface and satisfies the length and width of at least twice the diameter of probe can be.
  5. Non-destructive testing on samples, samples can be reused.
  6. The probe using the double-helix structure design, combined with the exclusive model, data collected on the probe using the core algorithm analysis.
  7. Sample stage designed, easy operation, suitable for different thickness of the sample.
  8. The probe data acquisition using the imported data acquisition on the chip, which is high resolution, can make the tests more accurate and reliable results.
  9. Host control system using the ARM microprocessor, speed is faster than traditional microprocessors, improves the processing capacity, more accurate results,
  10. It can be used for measuring bulk solids,pasty solid, granular solid, paste, gel, liquid, powders, coatings, thin film, thermal insulation materials.
  11. Intelligent freiendly human-computer interface, color LCD display, touch screen controls
  12. Powerful data processing capabilities. Highly automated computer processing system for data communication and reporting.

 

Technical parameters

Measure method 

Transient Plane Heat Source, Unsteady Status

Measurement physical properties

Direct access the thermal conductivity and thermal diffusivity

Test object 

Solid, liquid, powder, paste, colloid, granule

Test Range

0.005- - 300 W/(m*K)

sample temperature range

Room temperature ~ 130℃

Probe diameter

15 mm

Accuracy

±3%

Repeatability

≤3%

Measuring time

5- - 160 seconds 

Power supply & Total power

220VAC, ﹤100W

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