Molybdenum Niobium Sputtering Target

Description

Molybdenum Niobium Sputtering Target is a solid material used in a sputtering process to deposit thin films of molybdenum niobium onto a substrate. Sputtering is a technique in which atoms are ejected from the surface of a target material and then deposited onto a desired substrate to create a thin film.

Molybdenum Niobium Sputtering Target is typically made in the form of a disc or plate and is placed in a sputtering chamber. The chamber is then filled with an inert gas, such as argon, and a high voltage is applied to the target material. As a result, the gas ions are accelerated toward the target surface, causing atoms to be ejected and transferred to the substrate, forming a thin film.

Molybdenum Niobium Sputtering Target Specifications

Molybdenum Niobium Sputtering Target Handling Notes

1. Indium bonding is recommended for Molybdenum Niobium Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.
2. This material has a low thermal conductivity, and is susceptible to thermal shock.

Molybdenum Niobium Sputtering Target Application

Molybdenum Niobium Sputtering Target allows for precise control of film thickness and uniformity, making it an essential tool in various thin film deposition applications, including optoelectronics, integrated circuits, solar cells, and magnetic recording media.

Molybdenum Niobium Sputtering Target Packaging

Our Molybdenum Niobium Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.