Different Shapes of Sputtering Targets
(주)연진에스텍은 Planar (flat) Target과 Rotary (cylindrical) Target, Circular Target 및 Ring Target 등 대부분의 증착 공정에 부합하는 다양한 형태의 스퍼터링 타겟을 제공하며, 타겟 크기의 커스터마이즈가 가능합니다.
- High Purity & Performance 일관된 증착 품질과 오염을 줄이도록 가공합니다.
- Material Variety 다양한 응용 분야의 요구 사항에 맞게 순수 금속, 합금, 세라믹 및 화합물로 제공됩니다.
- Custom Manufacturing 특정 시스템의 필요요구 사항에 맞게 크기와 형태, 조성을 맞춤화했습니다.
- Precision Design 반복 가능하고 균일한 박막 결과를 위해 엄격한 공차로 제조되었습니다.
- Flexible Supply Chain 최고의 제조업체와 강력한 파트너십을 통해 일관된 품질과 on-time 납품을 보장합니다.
Barium Ferrite Sputtering Target, BaFe12O19
Barium Ferrite Sputtering
Target Description
Barium ferrite sputtering target is composed of barium, iron, and oxide with the chemical formula of BaFe12O19. High-purity BaFe12O19 sputtering targets play a huge role in deposition processes to ensure high-quality deposited film. Stanford Advanced Materials (SAM) specializes in producing up to 99.9995% purity sputtering targets using quality assurance processes to guarantee product reliability.
Barium Ferrite Sputtering Target Specification
|
Material Type |
Barium ferrite sputtering target |
|
Symbol |
BaCe(1-x-y)Y(x)Zr(y)O3 |
|
Color/Appearance |
Solid |
|
Melting Point |
1300 °C |
|
Density |
5.28 g/cm3 |
|
Type of Bond |
Elastomer, Indium |
|
Available Sizes |
Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ |
Other sizes are also available. Please contact us for customized sputtering targets.
Barium Ferrite Sputtering Target Target Bonding
Elastomer and Indium bonding is available for the barium ferrite sputtering targets. Stanford Advanced Materials is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services.
Barium Ferrite Sputtering Target Packaging
Our barium ferrite sputter targets are carefully handled to prevent damage during storage and transportation and to preserve the quality of our products in their original condition.
하기