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Sputtering Targets

Different Shapes of Sputtering Targets


(주)연진에스텍Planar (flat) TargetRotary (cylindrical) Target, Circular TargetRing Target 등 대부분의 증착 공정에 부합하는 다양한 형태의 스퍼터링 타겟을 제공하며, 타겟 크기의 커스터마이즈가 가능합니다.


Compound Target

Manganese Tin Sputtering Target, MnSn

YEONJIN S-Tech Corporation 2025-11-07 11:39:30 117

 


Manganese Tin Sputtering Target

Description

 

Manganese Tin Sputtering Targets are distinguished by their exceptional performance in the semiconductor and electronics industries. Renowned for outstanding electrical properties, these targets prove ideal for thin film deposition processes, ensuring reliable and efficient electronic component manufacturing. The alloy, composed of manganese and tin, contributes to their remarkable chemical stability, ensuring steadfastness throughout thin film preparation. The unique combination of manganese and tin alloys not only imparts excellent chemical stability but also offers adjustable physical properties. This versatility makes Manganese Tin Sputtering Targets adaptable to diverse thin film deposition applications, supporting advancements in electronics, semiconductors, and various high-tech industries. With precise control over physical properties, these targets play a crucial role in enhancing the performance and functionality of thin film applications across a broad spectrum of technological applications.

 

 

Manganese Tin Sputtering Target Specifications

Compound Formula

MnSn

Appearance

Grey Target

Available Sizes

Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

 

Thick: 0.125″, 0.250″

 

Manganese Tin Sputtering Target Handling Notes

  1. Indium bonding is recommended for the Manganese Tin Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.
  2. This material has a low thermal conductivity and is susceptible to thermal shock.

 

Manganese Tin Sputtering Target Application

  1. Semiconductor Manufacturing: Due to their excellent electrical properties, Manganese Tin Sputtering Targets are widely used in the semiconductor industry for thin film deposition, supporting the efficient preparation of electronic components and integrated circuits.
  2. Magnetic thin film preparation: The alloy combination of manganese and tin makes these targets excellent in preparing magnetic thin films for applications in magnetic storage, sensors and magnetic devices.
  3. Electronic device manufacturing: In the production of electronic devices, Manganese Tin Sputtering Targets are widely used for the preparation of thin films to improve the performance and stability of electronic components.
  4. Optical applications: These targets play a key role in the preparation of optical coatings for the production of films with special optical properties, such as filters and lenses.

 

Manganese Tin Sputtering Target Packaging

Our Manganese Tin Sputtering Target is carefully handled during storage and transportation to preserve the quality of our products in their original condition.

 

 

 

  • High Purity & Performance 일관된 증착 품질과 오염을 줄이도록 가공합니다. 
  • Material Variety  다양한 응용 분야의 요구 사항에 맞게 순수 금속, 합금, 세라믹 및 화합물로 제공됩니다. 
  • Custom Manufacturing 특정 시스템의 필요요구 사항에 맞게 크기와 형태, 조성을 맞춤화했습니다. 
  • Precision Design 반복 가능하고 균일한 박막 결과를 위해 엄격한 공차로 제조되었습니다. 
  • Flexible Supply Chain 최고의 제조업체와 강력한 파트너십을 통해 일관된 품질과 on-time 납품을 보장합니다. 


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