Different Shapes of Sputtering Targets
(주)연진에스텍은 Planar (flat) Target과 Rotary (cylindrical) Target, Circular Target 및 Ring Target 등 대부분의 증착 공정에 부합하는 다양한 형태의 스퍼터링 타겟을 제공하며, 타겟 크기의 커스터마이즈가 가능합니다.
Copper Manganese Nickel Sputtering Target, CuMnNi
Copper Manganese Nickel Sputtering Target Description
Copper Manganese Nickel Sputtering Target is a specialized material used in the process of sputtering, which is a technique for depositing thin films onto substrates. This target is composed of a combination of manganese, nickel, and copper. During sputtering, ions are directed at the target material, causing the release of atoms or particles. These released particles then deposit onto a substrate, creating a thin film. Copper Manganese Nickel Sputtering Targets find applications in various industries, including semiconductor manufacturing, optical coatings, and thin-film technology, where the unique properties of this combination of metals are utilized for specific performance requirements.
Copper Manganese Nickel Sputtering Target Specifications
|
Compound Formula |
CuMnNi |
|
Molecular Weight |
230.62 |
|
Appearance |
Silver Metallic Target |
|
Melting Point |
960-1020℃ |
|
Density |
8.4 g/cm3 |
|
Electrical Resistivity |
43-48 µΩ·cm |
|
Tensile Strength |
300-600 MPa |
|
Thermal Conductivity |
22 W/m/K |
|
Available Sizes |
Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″ |
Copper Manganese Nickel Sputtering Target Handling Notes
- Indium bonding is recommended for the Copper Manganese Nickel Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.
- This material has a low thermal conductivity and is susceptible to thermal shock.
Copper Manganese Nickel Sputtering Target Application
- Semiconductor Manufacturing: Due to their unique combination of alloys, Copper Manganese Nickel Sputtering Targets are used in the semiconductor industry for thin film deposition to prepare thin films for electronic components and integrated circuits.
- Optical Coatings: These targets play a key role in the preparation of optical coatings. They are used to prepare thin films with special optical properties for a variety of optical devices and applications.
- Magnetic Film Preparation: Due to the magnetic properties of nickel and copper, Copper Manganese Nickel Sputtering Targets are used to prepare magnetic films for a wide range of applications such as magnetic storage and sensors.
- Electronics: In the manufacture of electronic devices, these targets are commonly used to prepare thin films to improve the performance and stability of electronic components.
Copper Manganese Nickel Sputtering Target Packaging
Our Copper Manganese Nickel Sputtering Target is carefully handled during storage and transportation to preserve the quality of our products in their original condition.
- High Purity & Performance 일관된 증착 품질과 오염을 줄이도록 가공합니다.
- Material Variety 다양한 응용 분야의 요구 사항에 맞게 순수 금속, 합금, 세라믹 및 화합물로 제공됩니다.
- Custom Manufacturing 특정 시스템의 필요요구 사항에 맞게 크기와 형태, 조성을 맞춤화했습니다.
- Precision Design 반복 가능하고 균일한 박막 결과를 위해 엄격한 공차로 제조되었습니다.
- Flexible Supply Chain 최고의 제조업체와 강력한 파트너십을 통해 일관된 품질과 on-time 납품을 보장합니다.
하기