Different Shapes of Sputtering Targets
(주)연진에스텍은 Planar (flat) Target과 Rotary (cylindrical) Target, Circular Target 및 Ring Target 등 대부분의 증착 공정에 부합하는 다양한 형태의 스퍼터링 타겟을 제공하며, 타겟 크기의 커스터마이즈가 가능합니다.
- High Purity & Performance 일관된 증착 품질과 오염을 줄이도록 가공합니다.
- Material Variety 다양한 응용 분야의 요구 사항에 맞게 순수 금속, 합금, 세라믹 및 화합물로 제공됩니다.
- Custom Manufacturing 특정 시스템의 필요요구 사항에 맞게 크기와 형태, 조성을 맞춤화했습니다.
- Precision Design 반복 가능하고 균일한 박막 결과를 위해 엄격한 공차로 제조되었습니다.
- Flexible Supply Chain 최고의 제조업체와 강력한 파트너십을 통해 일관된 품질과 on-time 납품을 보장합니다.
Nickel Oxide Sputtering Target
Description
Nickel oxide sputtering target from Stanford Advanced Materials is an oxide sputtering material containing Ni and O.
Nickel is a chemical element that originated from the shortened of the German ‘kupfernickel’ meaning either devil’s copper or St. Nicholas’s copper. It was first mentioned in 1751 and observed by F. Cronstedt. The isolation was later accomplished and announced by F. Cronstedt. “Ni” is the canonical chemical symbol of nickel. Its atomic number in the periodic table of elements is 28 with a location at Period 4 and Group 10, belonging to the d-block. The relative atomic mass of nickel is 58.6934(2) Dalton, the number in the brackets indicating the uncertainty.
Oxygen is a chemical element that originated from the Greek ‘oxy’ and ‘genes’ meaning acid-forming. It was first mentioned in 1771 and observed by W. Scheele. The isolation was later accomplished and announced by W. Scheele. “O” is the canonical chemical symbol of oxygen. Its atomic number in the periodic table of elements is 8 with a location at Period 2 and Group 16, belonging to the p-block. The relative atomic mass of oxygen is 15.9994(3) Dalton, the number in the brackets indicating the uncertainty.
Nickel Oxide Sputtering Target Specification
|
Material Type |
Nickel Oxide |
|
Symbol |
NiO |
|
Color/Appearance |
Solid |
|
Melting Point |
1955 °C |
|
Density |
6.67 g/cm³ |
|
Type of Bond |
Indium bonding |
|
Available Sizes |
Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ |
Nickel Oxide Sputtering Target Handling Notes
1. Indium Bonding is recommended for nickel oxide sputtering target. Stanford Advanced Materials is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services.
2. This material has a low thermal conductivity are susceptible to thermal shock.
Packaging
Our nickel oxide sputtering target is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.
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