Description of Tin Silver Copper Target

(SnAgCu Target)

The SnAgCu Target is a sophisticated alloy designed to deliver superior performance in thin film deposition processes. Tin serves as the primary matrix, providing excellent wettability and a moderate melting point, which ensures consistent sputtering and uniform film creation. Silver enhances both electrical and thermal conductivity while boosting the mechanical strength and oxidation resistance of the resultant films. Copper adds to the alloy’s strength, hardness, and thermal fatigue resistance, making it suitable for challenging environments. This alloy features a lower melting point compared to pure metals, allowing for smooth sputtering at reduced energy levels. Additionally, the SnAgCu Target exhibits excellent adhesion properties, low surface roughness, and high purity, all of which are critical for achieving reliable, high-quality coatings in electronic and metallurgical applications.

Specifications of Tin Silver Copper Target (SnAgCu Target)

Material Composition: Sn, Ag, Cu
Purity: 99.99%
Shape: Planar Disc
Density: 9.15-9.92 g/cm³

Types and Properties:

Note: The above specifications are based on theoretical data. For customized specifications and detailed inquiries, please contact us directly.

Tin Silver Copper Targe Dimensions

• Thickness: 0.125 inch (customizable)
• Diameter: 12 inches (customizable)

Applications of Tin Silver Copper Target (SnAgCu Target)

The SnAgCu Target is extensively utilized in advanced electronics and thin film applications due to its excellent electrical, thermal, and mechanical properties. Key applications include:

• Semiconductor Manufacturing: Employed for sputtering interconnect and metallization layers, particularly in lead-free solder replacement processes compliant with environmental regulations like RoHS.
• Microelectronics: Used in the fabrication of printed circuit boards (PCBs) and surface mount devices (SMDs), where high conductivity and strong adhesion are essential.
• Solar Cells: Applied in the deposition of conductive layers in photovoltaic cells, ensuring precise and uniform film quality.
• MEMS Devices and Thin-Film Sensors: Provides reliable and stable coatings necessary for the performance and longevity of microelectromechanical systems.
• Metallization Processes: Ideal for creating durable and conductive coatings in various metallurgical applications.

Packaging Options for Tin Silver Copper Target (SnAgCu Target)

Our SnAgCu Targets are packaged to ensure their integrity during transit. Depending on the size and dimensions, smaller targets are securely placed in polypropylene (PP) boxes, while larger ones are shipped in custom-built wooden crates. We prioritize customized packaging solutions and utilize appropriate cushioning materials to provide maximum protection during transportation.

Packaging Options:

• Carton
• Wooden Crate
• Custom Packaging

Manufacturing Process

Testing Methods

1. Chemical Composition Analysis: Utilizes techniques such as Glow Discharge Mass Spectrometry (GDMS) or X-Ray Fluorescence (XRF) to verify purity and composition.
2. Mechanical Properties Testing: Assesses tensile strength, yield strength, and elongation to evaluate material performance.
3. Dimensional Inspection: Measures thickness, width, and length to ensure compliance with specified tolerances.
4. Surface Quality Inspection: Identifies defects like scratches, cracks, or inclusions through visual and ultrasonic examinations.
5. Hardness Testing: Determines material hardness to confirm uniformity and mechanical reliability.

Frequently Asked Questions about Tin Silver Copper Target (SnAgCu Target)

Q1: What purity levels are available for SnAgCu Targets from SAM?
A1: Stanford Advanced Materials offers SnAgCu Targets with purities up to 99.99%, ensuring high-performance sputtering with minimal contamination.

Q2: Is the SnAgCu Target RoHS compliant?
A2: Yes, SnAgCu is a lead-free alloy and fully complies with RoHS and other environmental regulations.

Q3: What deposition techniques are compatible with SnAgCu Targets?
A3: SnAgCu Targets are primarily used with DC and RF magnetron sputtering systems and are suitable for both batch and inline coating systems.

Performance Comparison: SnAgCu Target vs. Competing Materials

Additional Information

Raw Materials – Tin (Sn)

Physical Properties:

• Density: 7.31 g/cm³
• Melting Point: 231.9°C (449.4°F)
• Structure: Body-Centered Tetragonal (BCT)
• Magnetic: Non-magnetic

Chemical Properties:
Tin is a versatile post-transition metal known for its softness, malleability, and excellent corrosion resistance, especially in aqueous and acidic environments. It is widely utilized for surface coatings and alloying purposes to enhance lubrication, solderability, and reduce wear in mechanical systems. In thin films, tin contributes to improved ductility and wetting behavior.

Industrial Applications:

• Surface Coatings: Provides corrosion resistance and enhances lubrication in mechanical systems.
• Alloying Agent: Improves properties of various metal alloys used in electronics and construction.
• Soldering: Essential component in lead-free solder formulations.
• Thin Films: Utilized in electronic and metallurgical thin-film applications for its favorable wetting and adhesion properties.

Raw Materials – Silver (Ag)

Physical Properties:

• Density: 10.49 g/cm³
• Melting Point: 961.8°C (1,763.2°F)
• Structure: Face-Centered Cubic (FCC)
• Magnetic: Non-magnetic

Chemical Properties:
Silver is a highly conductive, lustrous metal known for its exceptional electrical and thermal conductivity. It exhibits excellent reflectivity, corrosion resistance, and malleability. With a high melting point, silver is ideal for applications requiring efficient thermal and electrical transfer. Additionally, silver possesses antimicrobial properties, making it valuable in medical and healthcare applications.

Industrial Applications:

• Electronics: Used extensively in conductive layers and interconnects.
• Jewelry and Silverware: Valued for its aesthetic appeal and workability.
• Medical Devices: Utilized for its antimicrobial properties in medical equipment.
• Thin Film Deposition: Forms high-quality, conductive layers essential for various electronic applications.

Raw Materials – Copper (Cu)

Physical Properties:

• Density: 8.96 g/cm³
• Melting Point: 1,085°C (1,984°F)
• Structure: Face-Centered Cubic (FCC)
• Magnetic: Non-magnetic

Chemical Properties:
Copper is a reddish-gold metal prized for its outstanding electrical and thermal conductivity, second only to silver. It boasts high ductility, excellent malleability, and robust resistance to corrosion in diverse environments. Copper is a critical material in electronics, electrical wiring, and metallization processes, often alloyed to enhance mechanical strength without significantly compromising conductivity.

Industrial Applications:

• Electrical Wiring: Essential for power transmission and electronic components.
• Electronics Manufacturing: Used in printed circuit boards (PCBs) and connectors.
• Construction: Utilized in plumbing and roofing due to its corrosion resistance.
• Thin Film Applications: Provides durable and conductive coatings in various metallurgical processes.