Different Shapes of Sputtering Targets
(주)연진에스텍은 Planar (flat) Target과 Rotary (cylindrical) Target, Circular Target 및 Ring Target 등 대부분의 증착 공정에 부합하는 다양한 형태의 스퍼터링 타겟을 제공하며, 타겟 크기의 커스터마이즈가 가능합니다.
- High Purity & Performance 일관된 증착 품질과 오염을 줄이도록 가공합니다.
- Material Variety 다양한 응용 분야의 요구 사항에 맞게 순수 금속, 합금, 세라믹 및 화합물로 제공됩니다.
- Custom Manufacturing 특정 시스템의 필요요구 사항에 맞게 크기와 형태, 조성을 맞춤화했습니다.
- Precision Design 반복 가능하고 균일한 박막 결과를 위해 엄격한 공차로 제조되었습니다.
- Flexible Supply Chain 최고의 제조업체와 강력한 파트너십을 통해 일관된 품질과 on-time 납품을 보장합니다.
Cobalt Platinum Sputtering Target, Co/Pt
Cobalt Platinum Sputtering Target
Description
Cobalt Platinum Sputtering Target is a specialized material used in a process known as sputter deposition. Sputtering is a thin film deposition technique where ions are used to bombard a target material, causing atoms to be ejected from the target and deposited onto a substrate to create a thin film.
Cobalt and platinum are both metals with unique characteristics that can be advantageous for certain applications. Platinum is known for its corrosion resistance and catalytic properties, while cobalt is often used in magnetic applications.
Cobalt Platinum Sputtering Target Specifications
|
Compound Formula |
Co/Pt |
|
Molecular Weight |
254.02 |
|
Appearance |
Metallic solid |
|
Melting Point |
1680-1770℃ |
|
Available Sizes |
Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″ |
Cobalt Platinum Sputtering Target Application
Cobalt Platinum Sputtering Target is widely used in the manufacturing of electronic devices, such as semiconductors, solar cells, and flat-panel displays.
Cobalt Platinum Sputtering Target Packaging
Our Cobalt Platinum Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.
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