Cryolite Sputtering Target
Description
Cryolite Sputtering Target is a material used in the sputtering process for depositing thin films onto substrates. Cryolite is a mineral compound consisting of sodium (Na), aluminum (Al), and fluorine (F) ions. In sputtering, high-energy ions are directed at the cryolite sputtering target, causing atoms or molecules to be ejected from the target surface. These ejected particles then deposit onto a substrate, forming a thin film with properties inherited from the cryolite material.
Cryolite Sputtering Target Specifications
|
Compound Formula |
Na3·AlF6 |
|
Molecular Weight |
209.94 |
|
Appearance |
Gray target |
|
Melting Point (℃) |
950-1012 |
|
Density (g/cm3) |
2.9-3.0 |
|
Available Sizes |
Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″ |
Cryolite Sputtering Target Handling Notes
- Indium bonding is recommended for Cryolite Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.
- This material has a low thermal conductivity and is susceptible to thermal shock.
Cryolite Sputtering Target Application
- Optical Coatings: Cryolite thin films can be used in optical coatings for various applications, such as anti-reflective coatings and interference filters.
- Semiconductor Manufacturing: Cryolite coatings may find applications in the semiconductor industry, particularly in the fabrication of electronic and optoelectronic devices.
- Research and Development: Cryolite thin films may be used in research and development for specific applications where the properties of cryolite are desirable.
Cryolite Sputtering Target Packaging
Our Cryolite Sputtering Target is widely used in the production of coatings for various purposes, such as improving the wear resistance of tools, enhancing the durability of surfaces, or providing specific optical or electrical properties.