Overview of Vanadium Tantalum Tungsten Target (VTaW Target)

The VTaW Target is a high-efficiency refractory alloy crafted for superior sputtering performance. This alloy integrates the flexibility and corrosion resistance of vanadium, the chemical stability and high-temperature endurance of tantalum, and the exceptional hardness and density of tungsten. The combination results in a fine-grained, uniform microstructure that promotes consistent sputtering and even film deposition. Its low vapor pressure at elevated temperatures ensures dependable operation in high-energy sputtering systems. Additionally, the VTaW Target’s resistance to oxidation and harsh environments makes it ideal for use in demanding processing conditions. The carefully balanced composition provides controlled thermal expansion and reduces structural degradation during thermal cycling, enhancing both target longevity and film quality during prolonged deposition processes.

Specifications of Vanadium Tantalum Tungsten Target (VTaW Target)

Chemical Composition: V, Ta, W
Purity: 99.95%
Shape: Planar Disc

Please note that the specifications above are based on theoretical data. For customized requirements and detailed inquiries, contact us directly.

Custom Dimensions

• Diameter: Customizable to specific requirements
• Thickness: Adjustable based on application needs

Applications of Vanadium Tantalum Tungsten Target (VTaW Target)

• Semiconductor Devices: Utilized in diffusion barriers and electrode layers to withstand high temperatures and prevent contamination between layers.

• Microelectromechanical Systems (MEMS): Applied in the fabrication of MEMS where thin films require durability, heat resistance, and precise deposition characteristics.

• Hard Coatings and Protective Layers: Ideal for creating ultra-durable coatings on cutting tools, aerospace components, and industrial machinery, thanks to their wear resistance and toughness.

• Aerospace and Defense Technologies: Employed in thermal barrier coatings and high-stress components within engines and propulsion systems that require resistance to thermal shock.

• Energy and Power Devices: Used in thin films for advanced batteries, fuel cells, and nuclear materials, benefiting from their stability in corrosive or high-radiation environments.

Packaging Options for Vanadium Tantalum Tungsten Target (VTaW Target)

Our VTaW Targets are packaged to ensure their integrity during shipping. Depending on the size and dimensions, smaller targets are securely placed in polypropylene (PP) boxes, while larger ones are shipped in custom-built wooden crates. We prioritize tailored packaging solutions and employ appropriate cushioning materials to provide maximum protection during transit.

Packaging Choices:

• Carton
• Wooden Box
• Custom Packaging

Manufacturing Process

Testing Methods

1. Chemical Composition Analysis: Utilizes techniques such as Glow Discharge Mass Spectrometry (GDMS) or X-Ray Fluorescence (XRF) to verify purity and composition.
2. Mechanical Properties Testing: Evaluates tensile strength, yield strength, and elongation to assess material performance.
3. Dimensional Inspection: Measures thickness, width, and length to ensure they meet specified tolerances.
4. Surface Quality Inspection: Identifies defects like scratches, cracks, or inclusions through visual and ultrasonic examinations.
5. Hardness Testing: Determines material hardness to confirm uniformity and mechanical reliability.

Frequently Asked Questions about Vanadium Tantalum Tungsten Target (VTaW Target)

Q1: What is the purity of the target material?
A1: SAM offers VTaW targets with a purity of ≥99.95%, ensuring high film quality and sputtering consistency.

Q2: What forms and sizes are available?
A2: VTaW targets are available in planar disc form, with customizable diameters, thicknesses, and backing plate configurations to accommodate various sputtering systems.

Q3: Is this target compatible with both DC and RF sputtering?
A3: Yes, VTaW targets are suitable for both DC and RF sputtering processes, depending on your specific equipment and film requirements.

Performance Comparison: VTaW Target vs. Tantalum Target vs. Tungsten Target

Additional Information

Raw Materials – Vanadium (V)

Physical Properties:

• Density: 6.11 g/cm³
• Melting Point: 1,910°C
• Structure: Body-centered cubic (BCC)
• Magnetic: Non-magnetic

Chemical Properties:

• Exhibits excellent strength-to-weight ratio and corrosion resistance.
• Forms stable compounds with various elements, enhancing alloy toughness and fatigue resistance.
• Creates thin, stable oxide layers suitable for high-temperature and chemically aggressive environments.

Industrial Applications:

• Alloying Agent: Enhances toughness and fatigue resistance in steel and other alloys.
• Catalysts: Used in certain chemical reactions and processes.
• High-Performance Alloys: Integral in aerospace and automotive components requiring high strength and durability.

Raw Materials – Tantalum (Ta)

Physical Properties:

• Density: 16.6 g/cm³
• Melting Point: 3,017°C
• Structure: Body-centered cubic (BCC)
• Magnetic: Non-magnetic

Chemical Properties:

• Highly resistant to corrosion, especially against acids.
• Forms a protective oxide layer that enhances its corrosion resistance.
• Extremely ductile and biocompatible, making it suitable for medical applications.

Industrial Applications:

• Electronics: Essential in the manufacture of capacitors and electronic components.
• Aerospace: Utilized in high-temperature and high-stress applications.
• Medical Devices: Used in implants and surgical instruments due to its biocompatibility.

Raw Materials – Tungsten (W)

Physical Properties:

• Density: ~19.3 g/cm³
• Melting Point: ~3,422°C
• Structure: Body-centered cubic (BCC)
• Magnetic Properties: Non-magnetic

Chemical Properties:

• Exhibits outstanding hardness and high resistance to thermal and mechanical fatigue.
• Highly resistant to corrosion and oxidation in various environments.
• Easily alloyed with other metals to enhance mechanical properties without compromising structural integrity.

Industrial Applications:

• Cutting Tools: Utilized in manufacturing tools that require extreme durability and hardness.
• High-Temperature Furnaces: Essential in applications requiring materials that can withstand very high temperatures.
• Sputtering Targets: Provides excellent structural stability for thin film deposition and metallization processes.