Tin Silver Sputtering Target Description

Tin Silver Sputtering Target is a material used in the sputtering deposition process. Sputtering is a widely used technique in thin film deposition, where atoms or ions are ejected from a solid target material and deposited onto a substrate to form a thin film.

Tin Silver Sputtering Target is often used in electronic applications, particularly in the manufacturing of solder alloys. The addition of silver to tin improves the mechanical properties, such as strength and ductility, of the solder, making it suitable for joining electronic components.

Tin Silver Sputtering Target Specifications

Tin Silver Sputtering Target Handling Notes

1. Indium bonding is recommended for the Tin Silver Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.
2. This material has a low thermal conductivity and is susceptible to thermal shock.

Tin Silver Sputtering Target Application

1. Electronic Manufacturing: Tin Silver Sputtering Targets play a crucial role in electronic manufacturing, contributing to the production of high-performance electronic devices due to their desirable electrical conductivity.
2. Semiconductor Manufacturing: These targets find significant applications in semiconductor manufacturing, contributing to the creation of efficient and reliable semiconductor components.
3. Coating Production: Tin Silver Sputtering Targets are instrumental in thin-film deposition processes, ensuring the production of precise and uniform coatings, essential for various industrial and research applications.
4. Nanotechnology Applications: The targets showcase versatility in nanotechnology applications, reflecting their adaptability and relevance in cutting-edge technologies.

Tin Silver Sputtering Target Packaging

Our Tin Silver Sputtering Target is carefully handled during storage and transportation to preserve the quality of our products in their original condition.