Zinc Nitride Sputtering Target Specification
|
Symbol |
Zn₃N₂ |
|
Appearance |
Gray solid |
|
Purity |
99.9% |
|
Density |
6.2 g/cm³ |
|
Melting Point |
~700 °C (decomposes) |
|
Sputtering Method |
RF or reactive DC sputtering |
|
Available Sizes |
Dia. 2″–6″, Thickness: 0.125″–0.25″ |
|
Bonding Options |
Elastomer bonding recommended |
|
Custom Options |
Available on request |
Note: Zn₃N₂ decomposes at elevated temperatures—process with caution and under controlled atmosphere.
Zinc Nitride Sputtering Target Application
Zinc nitride sputtering targets are ideal for RF or reactive sputtering of thin films in:
-
Optoelectronic Devices
Thin film transistors (TFTs), photodetectors, and sensor layers -
Semiconductors
Wide-bandgap compound for n-type channels and buffer layers -
Display Technologies
Transparent conductive films and backplane components for LCDs and OLEDs -
Photovoltaics
Window layers and buffer coatings in solar cells -
Glass Coatings
Functional coatings for anti-reflection, IR shielding, or architectural glass -
Optical Storage & Data Layers
Layer materials in optical data media with low optical loss
Bonding Services
Due to its moderate thermal stability and ceramic-like behavior, elastomer bonding is recommended for zinc nitride targets to reduce thermal shock and mechanical stress.
Backing plates (copper, stainless steel, molybdenum) are available to match your system specifications.
Packaging & Quality Assurance
Each target is vacuum-sealed and cushioned to prevent damage during transit. Labels and documentation include full material traceability. SAM applies stringent quality controls to ensure high purity, phase stability, and consistent microstructure.