Titanium Nitride Sputtering Target
Description
The TiN sputtering target is a ceramic material with a composition of titanium (Ti) and nitrogen (N), which is generally renowned for its excellent thin film deposition process performance.
Sputtering targets of titanium nitride are commonly applied in tool hard coating deposition, decorative coating, and conductive microelectronic films deposition. It is greatly valued for its:
- High corrosion resistance and durability.
- Improved uniformity and adhesion in coatings.
- Ease in suitability to different substrates such as silicon wafers, titanium alloys, and steel.
Why Use SAM’s TiN Sputtering Targets?
- Optimized for thin film application, ensuring perfect film development and microstructural control.
- Customizable sizes and shapes to suit research and industrial production needs.
- Backed by a global network for guaranteed quality and delivery.
Titanium Nitride Sputtering Target Specification
|
Material Type |
Titanium Nitride |
|
Symbol |
TiN |
|
Color/Appearance |
Yellow-Brown, Crystalline Solid |
|
Melting Point |
2,930° C |
|
Density |
5.4 g/cm3 |
|
Available Sizes |
Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ |
We also offer other customized shapes and sizes of the sputtering targets. Please send us an inquiry for more information.
Titanium Nitride Sputtering Target Ordering Options
|
Material |
Size |
Purity |
|
Titanium Nitride Sputtering Target |
1.00″ Dia. x 0.125″ Thick |
99.50% |
|
Titanium Nitride Sputtering Target |
1.00″ Dia. x 0.250″ Thick |
99.50% |
|
Titanium Nitride Sputtering Target |
2.00″ Dia. x 0.125″ Thick |
99.50% |
|
Titanium Nitride Sputtering Target |
2.00″ Dia. x 0.250″ Thick |
99.50% |
|
Titanium Nitride Sputtering Target |
3.00″ Dia. x 0.125″ Thick |
99.50% |
|
Titanium Nitride Sputtering Target |
3.00″ Dia. x 0.250″ Thick |
99.50% |
|
Titanium Nitride Sputtering Target |
4.00″ Dia. x 0.125″ Thick |
99.50% |
|
Titanium Nitride Sputtering Target |
4.00″ Dia. x 0.250″ Thick |
99.50% |
|
Titanium Nitride Sputtering Target |
57mm Dia. x 3mm Thick |
99.50% |
Titanium Nitride Sputtering Target Application
Industrial Coatings
TiN coatings enhance tool performance, providing increased wear resistance and corrosion protection. This is particularly beneficial for:
- Drills, milling cutters, and machining tools, extending their lifespan by 3x or more.
Microelectronics
TiN thin films are widely used in semiconductor devices as:
- Conductive barriers and diffusion layers to prevent metal migration.
Contact materials for circuits and connectors, ensuring stability and conductivity.
Decorative Coatings
With its metallic gold color, TiN is ideal for:
- Costume jewelry and automotive trims, offering both durability and aesthetics.
Bioelectronics
TiN films serve as electrodes in biosensors and implants, offering excellent corrosion resistance and biocompatibility.
Advanced Research
TiN is also used in space technology and materials research, including applications where extreme conditions demand high-performance materials.
Titanium Nitride Bonded Assemblies Ordering Options
Indium bonding and elastomeric target bonding services are available for Titanium Nitride sputtering targets. Stanford Advanced Materials is dedicated to the precision machining of standard backing plates and collaborates closely with Taiwan Bonding Company to deliver high-quality bonding solutions.
|
Material |
Target Size |
Purity |
Bonding Type |
Backing Plate Size |
|
Titanium Nitride Sputtering Target |
2.00″ Dia x 0.125″ Thick |
99.50% |
Indium |
2.00″ Dia x 0.125″ Thick |
|
Titanium Nitride Sputtering Target |
2.00″ Dia x 0.125″ Thick |
99.50% |
Elastomer |
2.00″ Dia x 0.125″ Thick |
|
Titanium Nitride Sputtering Target |
2.00″ Dia x 0.125″ Thick |
99.50% |
Indium |
2.00″ Dia x 0.092″ Thick |
|
Titanium Nitride Sputtering Target |
2.00″ Dia x 0.125″ Thick |
99.50% |
Elastomer |
2.00″ Dia x 0.125″ Thick |
|
Titanium Nitride Sputtering Target |
2.00″ Dia x 0.125″ Thick |
99.50% |
Indium |
3.00″ Dia x 0.125″ Thick |
|
Titanium Nitride Sputtering Target |
2.00″ Dia x 0.125″ Thick |
99.50% |
Elastomer |
3.00″ Dia x 0.092″ Thick |
|
Titanium Nitride Sputtering Target |
2.00″ Dia x 0.125″ Thick |
99.50% |
Elastomer |
3.00″ Dia x 0.125″ Thick |
|
Titanium Nitride Sputtering Target |
2.00″ Dia x 0.125″ Thick |
99.50% |
Elastomer |
3.00″ Dia x 0.092″ Thick |
|
Titanium Nitride Sputtering Target |
2.00″ Dia x 0.125″ Thick |
99.50% |
Elastomer |
3.00″ Dia x 0.125″ Thick |
|
Titanium Nitride Sputtering Target |
2.00″ Dia x 0.125″ Thick |
99.50% |
Indium |
4.00″ Dia x 0.125″ Thick |
|
Titanium Nitride Sputtering Target |
2.00″ Dia x 0.125″ Thick |
99.50% |
Elastomer |
4.00″ Dia x 0.125″ Thick |
Titanium Nitride Sputtering Target Packing
Our titanium nitride sputter coater targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.
FAQs for Titanium Nitride Sputtering Targets
Q1: What are the most common uses of Titanium Nitride sputtering targets?
A: Titanium Nitride (TiN) sputtering targets are widely used for thin film coatings that provide excellent wear resistance, corrosion protection, and decorative finishes. They are best suited for semiconductor devices, optical coatings, cutting tools, and flat panel displays.
Q2: What are the types of purity and bonds available in Titanium Nitride sputtering targets?
A: TiN targets are commonly offered at a purity of 99.5%. Bonding options include Indium bonding and elastomeric bonding, which help improve thermal conductivity and mechanical stability during sputtering.
Q3: How should Titanium Nitride sputtering targets be handled to get the best out of them?
A: Due to the brittle nature of nitride targets, power should be ramped up and down slowly during sputtering to minimize thermal stress and cracking. Bonding the target to a backing plate is recommended to maintain target integrity and improve heat dissipation.