Tantalum Nitride Sputtering Target
Description
Tantalum Nitride sputtering target from Stanford Advanced Materials is a nitride ceramic sputtering material with the formula TaN.
Tantalum is a chemical element that originated from King Tantalus, father of Niobe from Greek mythology. It was first mentioned in 1802 and observed by G. Ekeberg. “Ta” is the canonical chemical symbol of tantalum. Its atomic number in the periodic table of elements is 73 with a location at Period 6 and Group 5, belonging to the d-block. The relative atomic mass of tantalum is 180.94788(2) Dalton, the number in the brackets indicating the uncertainty.
Nitrogen is a chemical element that originated from the Greek ‘nitron’ and ‘genes’ meaning nitre-forming. It was first mentioned in 1772 and observed by D. Rutherford. The isolation was later accomplished and announced by D. Rutherford. “N” is the canonical chemical symbol of nitrogen. Its atomic number in the periodic table of elements is 7 with a location at Period 2 and Group 15, belonging to the p-block. The relative atomic mass of nitrogen is 14.0067(2) Dalton, the number in the brackets indicating the uncertainty.
Tantalum Nitride Sputtering Target Specification
|
Material Type |
Tantalum Nitride |
|
Symbol |
TaN |
|
Color/Appearance |
Solid |
|
Melting Point |
3090 °C |
|
Density |
14.3 g/cm3 |
|
Available Sizes |
Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ |
Tantalum Nitride Sputtering Target Application
The tantalum nitride sputtering target is used for thin film deposition, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.
Tantalum Nitride Sputtering Target Packaging
Our tantalum nitride sputtering target is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.