Niobium Titanium Sputtering
Target Description
Niobium Tztanium Sputtering Target is a material used in the process of sputtering, which is a technique widely employed in the field of thin film deposition. Sputtering is the process of ejecting atoms or ions from a solid target material through bombardment with high-energy particles, usually ions. The ejected particles are then deposited onto a substrate to form a thin film.
Niobium Titanium Sputtering Target Specifications
Compound Formula |
Ti/Nb |
Appearance |
Gray metallic target |
Molecular Weight |
140.773 |
Available Sizes |
Dia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″ |
Niobium Titanium Sputtering Target Handling Notes
- Indium bonding is recommended for Niobium Titanium Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.
- This material has a low thermal conductivity, and is susceptible to thermal shock.
Niobium Titanium Sputtering Target Application
Niobium Titanium Sputtering Target is widely used in semiconductors, superconductors, sensor technologies, optical coatings, and many other fields where precise thin film deposition is required.
Niobium Titanium Sputtering Target Packaging
Our Niobium Titanium Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.