Titanium Aluminum Silicon Sputtering Target Description

Titanium Aluminum Silicon Sputtering Target is a material used in sputtering deposition processes. Sputtering is a technique used to deposit thin films of materials onto a substrate surface, commonly used in applications such as electronics, optics, and thin-film solar cells.

The TiAlSi sputtering target is made up of a combination of titanium, aluminum, and silicon. These elements provide specific properties that make them suitable for different applications. Titanium is known for its high strength, corrosion resistance, and bio-compatibility. Aluminum is highly conductive and lightweight, making it suitable for electrical and thermal applications. Silicon has excellent semiconductor properties and is commonly used in integrated circuits and solar cells.

Titanium Aluminum Silicon Sputtering Target Specifications

Titanium Aluminum Silicon Sputtering Target Handling Notes

1. Indium bonding is recommended for Titanium Aluminum Silicon Sputtering Target, due to some of its characteristics not amenable to sputtering like brittleness, low thermal conductivity, etc.
2. This material has a low thermal conductivity, and is susceptible to thermal shock.

Titanium Aluminum Silicon Sputtering Target Application

Titanium Aluminum Silicon Sputtering Targets are used in various applications, including coating devices, optical coatings, microelectronics, and photovoltaics. The specific composition of the target can be optimized for different applications, allowing for the deposition of thin films with specific properties and characteristics.

Titanium Aluminum Silicon Sputtering Target Packaging

Our Titanium Aluminum Silicon Sputtering Targets are carefully handled during storage and transportation to preserve the quality of our products in their original condition.