Sputtering Targets

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Different Shapes of Sputtering Targets

(주)연진에스텍은 Planar (flat) Target과 Rotary (cylindrical) Target, Circular Target 및 Ring Target 등 대부분의 증착 공정에 부합하는 다양한 형태의 스퍼터링 타겟을 제공하며, 타겟 크기의 커스터마이즈가 가능합니다.

Compound Target

Gold Platinum Sputtering Target, Au/Pt

2025-11-11 09:53:09 102

Gold Platinum Sputtering Target

Description

Gold platinum sputtering targets are fabricated by combining high-purity gold and platinum materials to create a homogeneous alloy. These targets are carefully machined into specific shapes suitable for sputtering. The alloy composition can be tailored to meet desired properties, such as specific electrical conductivity, corrosion resistance, or other characteristics.

Gold Platinum Sputtering Target Specification

Material Type	Gold Platinum
Symbol	Au/Pt
Color/Appearance	Solid
Molecular Weight	392.05
Monoisotopic Mass	391.931 g/mol
Melting Point	Varies based on alloy composition, typically above 1,000°C (1,832°F)
Available Sizes	Dia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″ Thick: 0.125″, 0.250″

Other alloy compositions, shapes, sizes, and purity customization are available.

Gold Platinum Sputtering Target Application

Gold-platinum alloy sputtering targets are used in a range of applications, particularly in the electronics and sensor industries. These alloys offer a unique combination of properties, including excellent electrical conductivity, resistance to corrosion, and biocompatibility. They are employed to deposit thin films of gold-platinum alloys on substrates for applications such as electrical contacts, biosensors, and electrode materials in a variety of devices.

Gold Platinum Sputtering Target Packing

Our metal alloy gold platinum sputter coater targets are tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.