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Vacuum Deposition System from Moorfield Nanotechnology, UK

Physical Vapour Deposition (PVD) , Chemical Vapour Deposition (CVD)

Evaporation, Soft-etching, Annealing (Thermal Processing), Electron microscopy coating

진공증착시스템 (Vacuum Deposition System)

nanoPVD-S10A, Magnetron sputtering system

 
nanoPVD-S10A는 benchtop의 RF 및 DC 마그네트론 스퍼터링 시스템으로써, 전자현미경 코팅 장비와 같이  컴팩트하고, 고급 수준의 하드웨어를 갖추고 있습니다. 금속 및 절연 재료의 연구와 품질관리에 사용됩니다. 

 

Techniques:

Physical vapour deposition

 

The nanoPVD-S10A is a magnetron sputtering system compact enough to be located benchtop, but that can be fitted with DC and/or RF power supplies for deposition of metals or insulating materials such as oxides or nitrides.

Magnetrons (up to 3 can be fitted) are water-cooled, allowing for high powers and sustained operation, and sized for accepting industry-standard targets. Units have turbomolecular pumping systems for low-contamination operation. Co-deposition is possible, as is reactive sputtering via the gas/pressure control module that can support up to 3 process gases.

Chamber access is via a hinged lid, that opens to reveal a stage suitable for holding substrates up to 4″ diameter.

The units are easy to control via a touchscreen HMI interface, simple to maintain, have low running costs and come with a comprehensive range of safety features.

 

Key features

  • Benchtop configuration
  • Water-cooled magnetron sputtering sources for industry-standard 2″ targets
  • MFC-controlled process gases
  • DC and/or RF power supplies
  • Fully automatic operation via touchscreen HMI
  • Define/save multiple process recipes
  • Up to 4” diameter substrates
  • Base pressures <5 × 10-7 mbar
  • Equipped for easy servicing
  • Comprehensive safety features
  • Cleanroom compatible
  • Proven performance

 

Options

  • Dry backing pump
  • Fast chamber vent
  • Automatic high-resolution pressure control
  • Additional process gases
  • 500 °C substrate heating stage
  • Substrate rotation, Z-shift and shutters
  • Up to 3 magnetron sputtering sources
  • RF and/or DC power supplies
  • SputterSwitch power supply/source switching technology
  • Co-deposition
  • Quartz crystal sensor head

 

Typical configurations

Metals deposition
2 magnetrons with DC power supply and SputterSwitch module for shared output, substrate Z-shift and bi-shutter for best 4″ substrate geometries, quartz crystal sensor head for rate/thickness calibration.

TCO/dielectrics sputtering
2 magnetrons with RF power supply and SputterSwitch module for shared output, substrate heating and additional oxygen process gas line for enhanced film properties, substrate Z-shift and bi-shutter. Quartz crystal sensor head.

Reactive/co-deposition
3 magnetrons with RF and DC power supplies and SputterSwitch module for fully-flexible power supply/source routing. 3 process gases (argon, oxygen and nitrogen) for reactive deposition of oxides and nitrides.

 

 

Service requirements

All nanoPVD-S10A systems require chilled water, dry compressed air, nitrogen for venting (optional), process gas supplies, and electrical power. Exact requirements will be provided with quotations or on request.

 

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