공초점 스퍼터링(confocal sputtering), 6 pocket linear e-beam source, 이온 밀링 (ion milling) 및 짧은 working distance - direct sputtering을 위한 retractable sputter source (예 : Nb 초전도체)가 통합되어 있습니다. 또한 이 UHV 장비에는 기판 냉각 및 azimuthal rotation 기능이 있는 ±200° 틸팅 기판 홀더가 포함됩니다.
General Information
AJA International ATC-M Series Multi-Technique Systems are versatile tools that combine various thin film deposition, ion milling and analytical operations in a single chamber (Hybrid Systems) or in multiple chambers (Multi-Chamber Systems) to allow the in-situ transfer of substrates from process to process without breaking vacuum.
These systems can be built in HV or UHV configurations, and in either cylindrical, box or machined chambers styles.
Multi-Techniques employed include:
- Magnetron Sputtering
- E-Beam Evaporation
- Thermal Evaporation
- Ion Milling
- Ion Beam Deposition
- Pulsed Laser Deposition
- Ellipsometry
- Rapid Thermal Anneal
- Oxygenation and Nitridization
- XPS/AUGER/LEED Analysis
- MBE, RHEED, MOS, SIMS, RIBE
Incorporates confocal sputtering, a (6) pocket linear e-beam source, ion milling and a retractable sputter source for short working distance direct sputtering (e.g. Nb superconductors). This UHV tool also incorporates a +/- 200° tilting substrate holder with substrate cooling and azimuthal rotation.
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