MiniLab 060은 MiniLab 제품군에서 가장 인기 있는 플랫폼으로, multiple-source magnetron sputtering과 thermal evaporation, e-beam evaporation에 이상적인 front-loading box-type chamber를 사용합니다.
Techniques:
Thermal evaporation, Low-temperature thermal evaporation (LTE), E-beam evaporation, Magnetron sputtering
MiniLab 060 standard configuration에는 터보펌프가 포함되며, 진공 챔버 후면의 ISO160 포트에 놓입니다. 진공 챔버는 모든 system control electronics 및 power supply를 포함하는 double-rack frame에 있습니다. MiniLab 060 시스템은 load-lock과 함께 사용할 수 있습니다.
본 모델에는 열 증착 및 저온 증착 소스(금속 및 유기물), 마그네트론 스퍼터링 음극 (금속 및 무기물), 전자빔 (E-Beam) 소스(유기물을 제외한 대부분의 재료)를 비롯한 다양한 증착 기술이 장착될 수 있습니다. 증착 소스(deposition source)는 일반적으로 chamber baseplate에 장착되지만 sputter-down 구성도 가능합니다.
일반적으로 챔버 상단에 있는 기판 스테이지는 최대 11" 직경의 기판을 수용할 수 있습니다. 기판 가열, 회전, bias 및 Z-shift를 planetary stage, 소스 및 기판 셔터와 함께 사용할 수 있습니다. 수동 열증착 시스템에서 완전 자동화된 프로세스 컨트롤러를 갖춘 멀티테크닉 장비에 이르기까지 다양하게 구성됩니다.
Key features
- Modular design
- Front-loading box-type vacuum chamber
- Turbomolecular and cryo pumping systems
- Base pressures <5 × 10-7 mbar
- Metals, dielectrics and organics deposition
- Up to 11” diameter substrates
- Touchscreen HMI/PC for system control
- Equipped for easy servicing
- Comprehensive safety features and interlocks
- Cleanroom compatible
- Load-locks available
Options
- Pumping: Turbomolecular or cryogenic high-vacuum pumps, rotary or scroll backing pumps.
- Gas / pressure: Manual or automatic control via MFCs and throttle valves.
- Load-locks: Single- and multiple-sample.
- Stages: Rotation, heating, cooling, Z-shift, bias and planetary.
- Shutters: Source and substrate, pneumatic or motorised.
- Operation: Manual or automatic via front panels, touchscreen HMI or PC.
- Process: Quartz crystal sensor heads for rate/thickness monitoring or feedback-loop control.
The most popular platform in our MiniLab range, MiniLab 060 systems have front-loading box-type chambers ideal for multiple-source magnetron sputtering but also thermal and e-beam evaporation.
The MiniLab 060 standard configuration includes a turbomolecular pump positioned on an ISO160 port at the rear of the vacuum chamber. The vacuum chamber sits on a double-rack frame that contains all system control electronics and power supplies. MiniLab 060 systems are available with load-locks—please call for details.
Tools can be equipped with a wide variety of deposition techniques, including thermal and low-temperature evaporation sources (for metals and organics), magnetron sputtering cathodes (for metals and inorganics), and electron-beam sources (for most material classes except organics). Deposition sources are typically mounted on the chamber baseplate, but sputter-down configurations are also available.
Substrate stages, usually at the top of the chamber, can accommodate substrate sizes up to 11” diameter. Substrate heating, rotation, bias and Z-shift are available, together with planetary stages and source and substrate shutters. Configurations range from a manually operated thermal evaporation system up to a multi-technique tool with fully-automated process control.
Typical configurations
Thermal evaporation (metals):
Four-source TE4 thermal evaporation component with source shutters and rotation stage. High power TEC-4A power supply and controller with recipe-based automated control. Quartz crystal sensor head with PC software for rate/thickness monitoring.
Thermal evaporation (metals and organics):
Two TE1 thermal evaporation sources for metals and two LTE-1CC components for organics. Source shutters and rotation stage. Evaporation power supplies linked to quartz crystal sensor head and Inficon SQC-310 process controller for automated process control per user-defined rates/thicknesses.
E-beam evaporation:
Multi-pocket (e.g., 6 × 7 cc or 8 × 4 cc) water-cooled e-beam source with 5 kW power supply/controller and automated pocket selection. Source and substrate shutters, and rotation. Quartz crystal sensor heads with Inficon SQC-310 process controller for automated process control per user-defined rates/thicknesses.
Magnetron sputtering::
Up to four water-cooled magnetron sources for 3″ circular targets. RF and DC power supplies with SputterSwitch technology for shared outputs. Source shutters and substrate rotation. Recipe-based power vs. time process control.
Service requirements
All MiniLab 060 tools require chilled water, dry compressed air, nitrogen for venting (optional) and electrical power (three-phase for e-beam evaporation). Sputtering systems also require process gases (argon, oxygen and nitrogen). Exact requirements will be provided with quotations or on request.
