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Surface Techniques

Patterning and Surface Texturing Systems, Vacuum Deposition System, Adhesion Testing Equipment

ATC Dual Chamber with Common Cassette Load-lock

본 듀얼 스퍼터링 시스템은 "vacuum suitcase"과 호환되는 6 position cassette가 있는 common load-lock으로 연결됩니다. 왼쪽 챔버에는 7개의 fixed angle sputter source가 포함되어 있으며 기본 압력은 1.0 x 10-8 Torr입니다. 오른쪽 챔버는 일체형 베이킹 재킷 (bake jacket), 4개의 in-situ tilt 스퍼터 소스, 격자 형 이온 소스를 특징으로하며 10-10 Torr 범위의 기본 압력을 가집니다.

 

General Information

AJA International ATC-M Series Multi-Technique Systems are versatile tools that combine various thin film deposition, ion milling and analytical operations in a single chamber (Hybrid Systems) or in multiple chambers (Multi-Chamber Systems) to allow the in-situ transfer of substrates from process to process without breaking vacuum. 

These systems can be built in HV or UHV configurations, and in either cylindrical, box or machined chambers styles.

Multi-Techniques employed include:

  • Magnetron Sputtering
  • E-Beam Evaporation 
  • Thermal Evaporation
  • Ion Milling
  • Ion Beam Deposition
  • Pulsed Laser Deposition
  • Ellipsometry
  • Rapid Thermal Anneal
  • Oxygenation and Nitridization
  • XPS/AUGER/LEED Analysis
  • MBE, RHEED, MOS, SIMS, RIBE
ATC Dual UHV
The dual sputtering system above is connected by a common load-lock with (6) position cassette with "vacuum suitcase" compatibility.  The chamber on the left includes (7) fixed angle sputter sources and has a 1.0 x 10-8 Torr base pressure.  The chamber on the right features an integral bake jacket, (4) in-situ tilt sputter sources, a gridded ion source and has a base pressure in the 10-10 Torr range.


 

 

AJA International Inc, USA
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TYPICAL HYBRID SYSTEMS CONFIGURATIONS ATC 1800-HY Hybrid System 공초점 스퍼터링(confocal sputtering), 6 pocket linear e-beam source, 이온 밀링 (ion milling) 및 짧은 working dista
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