HCC602 Wide temperature range Hot / cold chuck

Thermal Properties Analyzer

Thermal Conductivity (Lambda), Ash Fusion, Thermal Screening, Microscopic Hot/Cold Stage, Wafer Chuck, Thermal Plate, Thermal Probe Station

Home > Products > 열물성분석기 (열전도도, 회융점, Tm, Hot/cold stage) > Wafer Chuck

Wafer Chuck

Surface Options	Silver
Wafer Vacuum Control	Independent vacuum channels Custom vacuum holes available
Base Cooling	Integrated base cooling via hose barb ports with optional chiller system
Mounting	Probe station mounting capability Custom adapter options
Surface Electrical Options	Floating
Temperature Control	mK2000 with programmable precision switching PID method Optional LVDC PID method to minimize electrical noise
Temperature Sensor	100 Ω Platinum RTD
Temperature Resolution	0.01°C
Temperature Stability	±0.05°C (above 25°C) and ±0.1°C (below 25°C)
Power Supply	Universal power input
Software	Windows software to record and export temperature-time data

Instec, Inc. USA

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Wafer Chuck HCC602 Wide temperature range Hot / cold chuck Small footprint Wide temperature range: -190°C to 600°C Sample sizes: 3mm up to 50mm Silver surface

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