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Thermal Properties Analyzer

Thermal conductivity (Lambda), Ash fusion, Thermal screening

Microscopic Hot/Cold Stage, Wafer chuck, Thermal plate, Thermal probe station

Home > Products > 열물성분석기 (열전도도, 회융점, Tm, Hot/cold stage)

용융점측정기 Melting point tester, MP-400 Photoelectric automatic detection 용융점측정온도: 상온 ~ 400 ℃ 약전에 의한 capillary sample tube Features Adopts

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용융점측정기 Melting point analyzer, MP-400D Melting point is the basic test method to identify the physical nature, also used to measure purity.

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열전도도측정기 TPS 열전도도측정기 본 열전도도측정기는 ISO 22007-2 2008에 따른 다양한 재료의 열전달 특성을 측정하는 데 사용되는 최신의 Transient Plane Heat Source (TPS) me

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열전도도측정기 나노유체 열전도도측정기 - LAMBDA Thermal Conductivity Meter 독일 flucon fluid control사의 LAMBDA는 ASTM D7896-19에 따른 열선법을 사용하여, 넓은 온도와 압력 범위에서 열전도도와 열확산율, 비열을 신속하게

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회융점측정기 SDAF105 Ash Fusion Tester (회융점측정기) Improved Efficiency with Dual Configuration · Up to 9 samples can be analyzed simultaneously in one

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열전도도측정기 Guarded Hot Plate Thermal Conductivity Test Tool λ-Meter EP500e EP500e는 단열재의 열전도도 절대값과 열저항, k-value, U-value 를 측정하는 Guarded Hot Plate (GHP) 열전도도측정기입니다. ISO 8302, E

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Wafer Chuck HCC ROUND WAFER CHUCKS Round thermal wafer chucks Designed for wafer handling Modern electrical probing and testing Multi

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Wafer Chuck HCC SQUARE WAFER CHUCKS Square sample area to accommodate various sample sizes and shapes Better integrate into some experi

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Thermal Plate Square Hot and Cold Plates With Gas Tight Covers Benchtop workhorses for all-purpose laboratory thermal control Precision temperature control -190°C

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