메뉴 건너뛰기

Surface Techniques

Patterning and Surface Texturing Systems, Vacuum Deposition System, Adhesion Testing Equipment

ATC UHV Dual Chambers

In-situ tilt를 가진 4개의 A320-XP 2 인치 UHV 스퍼터 소스,  2개의 4- 포켓 15cc UHV linear e-gun, RF 이온 소스, 1200 l/s 터보 펌프, RF 바이어스가 있는 850°C 회전 기판 히터, 컴퓨터 컨트롤 및 100mm Ø 기판에 대한 common vertex load-lock로 구성된 듀얼 UHV ATC 1800 / 2200E (Sputter / E-Beam) 시스템입니다.

 

General Information

AJA International ATC-M Series Multi-Technique Systems are versatile tools that combine various thin film deposition, ion milling and analytical operations in a single chamber (Hybrid Systems) or in multiple chambers (Multi-Chamber Systems) to allow the in-situ transfer of substrates from process to process without breaking vacuum. 

These systems can be built in HV or UHV configurations, and in either cylindrical, box or machined chambers styles.

Multi-Techniques employed include:

  • Magnetron Sputtering
  • E-Beam Evaporation 
  • Thermal Evaporation
  • Ion Milling
  • Ion Beam Deposition
  • Pulsed Laser Deposition
  • Ellipsometry
  • Rapid Thermal Anneal
  • Oxygenation and Nitridization
  • XPS/AUGER/LEED Analysis
  • MBE, RHEED, MOS, SIMS, RIBE

 

ATC UHV Dual Chambers
Dual UHV ATC 1800/2200E (Sputter/ E-Beam) system with (4) A320-XP 2 " UHV sputter sources with in-situ tilt, (2) 4-pocket 15cc UHV linear e-guns, RF ion source, 1200 l/s turbopumps, 850°C rotating substrate heaters with RF bias, computer control, and common vertex load-lock for 100 mm Ø substrates.


 

 

AJA International Inc, USA
share
TYPICAL MULTI-TECHNIQUE SYSTEM CONFIGURATIONS ATC UHV Dual Chambers In-situ tilt를 가진 4개의 A320-XP 2 인치 UHV 스퍼터 소스, 2개의 4- 포켓 15cc UHV linear e-gun, RF 이온 소스, 1200 l/s 터보
댓글 0
169
« 1 2 3 »
« 2 / 3 »