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Thermal Properties Analyzer

Thermal Conductivity (Lambda), Ash Fusion, Thermal Screening, Microscopic Hot/Cold Stage, Wafer Chuck, Thermal Plate, Thermal Probe Station

TEC BASED SQUARE WAFER CHUCKS


  • Thermoelectric cooling and heating
  • Square shape accommodates various sample sizes and shapes
  • Cooling down to -30°C without using LN2
  • Multi vacuum zones for different wafer sizes
  • Optional triaxial for pA current measurements

 

FEATURES

Surface Options

  • Standard: clear anodized aluminum
  • Optional: nickel, zinc, or gold plating

Wafer Vacuum Control

  • Independent vacuum channels
  • Custom vacuum holes available

Base Cooling

Integrated base cooling via hose barb ports with optional chiller system

Mounting

  • Probe station mounting capability
  • Custom adapter options

Surface Electrical Options

grounded (S), floating (SF), or triaxial (ST) surfaces

BNC Connector Options

Coaxial, floating, or triaxial BNC

Temperature Control

mK2000 with programmable precision switching PID method

Optional LVDC PID method to minimize electrical noise

Temperature Sensor

100 Ω Platinum RTD

Temperature Resolution

0.01°C

Temperature Stability

±0.05°C

Power Supply

Universal  power input

Software

Windows software to record and export temperature-time data

 

MODELS

Model

SIZE, mm

Fits  Samples

Weight  

Temperature  Range

Maximum  Rate at 100°C

MIN

MAX

MIN

MAX

Heating

Cooling

TC102S

81 X 56 X 22

12mm

50mm

0.4 kg

-30°C

120°C

+40°C  / min

-15°C  / min

TC104S

132 x 110 x 28

12mm

100mm

1.0 kg

-30°C

120°C

+20°C  / min

-10°C  / min

TC106S

200 x 160 x 30

40mm

150mm

3.0 kg

-30°C

120°C

+15°C  / min

-6°C  / min

TC108S

250 x 210 x 35

40mm

200mm

10 kg

-30°C

120°C

+12°C  / min

-4°C  / min

TC10CS

355 x 315 x 40

100mm

300mm

25 kg

-30°C

120°C

+7°C  / min

-4°C  / min

 

 

Instec, Inc. USA
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