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Thermal Properties Analyzer

Thermal Conductivity (Lambda), Ash Fusion, Thermal Screening, Microscopic Hot/Cold Stage, Wafer Chuck, Thermal Plate, Thermal Probe Station

Vacuum Benchtop Probe Station

Vacuum Benchtop Probe Station


Tabletop design with small footprint integrate with modern instruments and benches

  • -190°C - 1000°C depending on model

  • Fits 10 mm - 300 mm wafers and devices

  • Sealed chamber with gas purging or vacuum capability

  • 4 independent electrical probes with remote positioning


 

MODELS

  • TP102V-PS Series operates from -40°C to 180°C with thermoelectric cooling and heating and vacuum options
  • HCP422V-PS Series operates from -190°C (with liquid N2 cooling) to 400°C (with resistive heating) with vacuum
  • HP1000V-PS Series operates from 35°C to 1000°C with resistive heating only, and supports vacuum
  • CUSTOM Series available to achieve lower and higher temperatures and custom features for any application

 

STRUCTURAL FEATURES

Sample Area

Fits 10 mm-300 mm wafers and devices

Chamber Height

6 mm

Probe Positioning

XYZ micropositioners remotely manipulate probes within sealed sample chambers with 20 mm fine travel

Atmosphere Control

Gas purging or vacuum capability to control humidity, condensation, and oxidation

Frame Cooling

Integrated frame cooling via hose barb ports with optional chiller system

Frame Dimensions

1060 mm x 600 mm x 213.2 mm

Weight

20 kg, aluminum or stainless steel options

 

OPTICAL FEATURES

Optical Access

Reflection capability via large window

Optical Windows

Removable and exchangeable windows permit full-spectrum transparency

Minimum Objective Working Distance

25 mm

Top Window

50 mm diameter

Top Viewing Angle

±40° from normal

Window Defrost

Integrated external window defrost

 

ELECTRICAL FEATURES

Electrical Probes

Standard tungsten-rhenium DC probes with other probe options available

Probe Positioning

XYZ micropositioners remotely manipulate probes within sealed sample chambers with 20 mm fine travel

Connectors

Coaxial, floating, or triaxial BNC connectors

Sample Surface

Grounded, floating, or triaxial options

 

THERMAL FEATURES

Temperature Control

mK2000 with programmable precision LVDC PID method to minimize electrical noise

Thermal Block

Aluminum, Silver, or Ceramic options for superior thermal uniformity

Temperature Resolution

0.01°C (RTD) or 0.1°C (Themocouple )

Temperature Stability

±0.05°C at 100°C

Power Supply

115 V or 230 V depending on region

Software

Windows software to record and export temperature-time data

 

APPLICATIONS

  • Characterize electrical behavior of thin films, 2D materials, nanomaterials, and molecular/organic electronic devices
  • Electrically grounded, floating, or triaxial options for the thermal block surfaces and triaxial BNC connectors
  • DC electrical probe options in tungsten-rhenium, beryllium-copper, or other materials
  • Remotely manipulate probes in sealed chambers with XYZ positioning
  • Test components of wafers, semiconductor devices, integrated circuits, printed circuit boards, photovoltaics, LC’s, and LED’s
  • Measure IV and CV characteristics, breakdown voltage, leakage current, resistance, dielectric strength, and diode efficiency

 

 

 

Vacuum Benchtop Probe Station


 

Instec, Inc. USA
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