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Thermal Properties Analyzer

Thermal Conductivity (Lambda), Ash Fusion, Thermal Screening, Microscopic Hot/Cold Stage, Wafer Chuck, Thermal Plate, Thermal Probe Station

HCC602 Wide temperature range Hot / cold chuck


  • Small footprint
  • Wide temperature range: -190°C to 600°C
  • Sample sizes: 3mm up to 50mm
  • Silver surfaces
  • Optional floating surfaces. 

 

FEATURES

Surface Options

Silver

Wafer Vacuum Control

  • Independent vacuum channels
  • Custom vacuum holes available

Base Cooling

Integrated base cooling via hose barb ports with optional chiller system

Mounting

  • Probe station mounting capability
  • Custom adapter options

Surface Electrical Options

Floating

Temperature Control

  • mK2000 with programmable precision switching PID method
  • Optional LVDC PID method to minimize electrical noise

Temperature Sensor

100 Ω Platinum RTD

Temperature Resolution

0.01°C

Temperature Stability

±0.05°C (above 25°C) and ±0.1°C (below 25°C)

Power Supply

Universal  power input

Software

Windows software to record and export temperature-time data

 

Instec, Inc. USA
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